Board Level Heatsinks

 
Bluecore offer a wide range of board level heat sinks that are designed to cool specific product packages. These heat sinks are widely used in electronics, and are specific to JEDEC packages such as TO220, TO247, TO202 and TO218.  Our stamped heat sinks provide highly effective cooling for small packages and efficient manufacturing techniques mean they meet market demands for cost effective solutions.

We offer a complimentary range of mounting methods and thermal compounds to maximise heat dissipation.

Our competitor cross reference service helps to simplify your choice, simply send us a comparable part number and we will do the rest.

 
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DESIGN SERVICES

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PROTOTYPING AND TESTING

  • CMM and precision measuring tools
  • Thermal measurement devices
  • Thermal chambers
  • Shock testing and cycling
  • Salt spray testing for corrosion analysis

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MANUFACTURING

  • State of the art CNC machinery
  • Stringent quality control
  • Latest production techniques
  • Focus on continuous improvement
  • Robust packaging design

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10Years of Outstanding Service
33Countries Supplied
52Production Machines
1000Extrusion Profiles
 
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